Tsuchiura, Japan

Toru Kurenuma

USPTO Granted Patents = 9 

Average Co-Inventor Count = 5.8

ph-index = 4

Forward Citations = 141(Granted Patents)


Location History:

  • Tsuchiura, JP (2003 - 2013)
  • Ibaraki, JP (1992 - 2014)

Company Filing History:


Years Active: 1992-2014

where 'Filed Patents' based on already Granted Patents

9 patents (USPTO):

Title: The Innovations of Toru Kurenuma

Introduction

Toru Kurenuma is a notable inventor based in Tsuchiura, Japan. He has made significant contributions to the field of microscopy, particularly through his innovative patents. With a total of nine patents to his name, Kurenuma has focused on enhancing the capabilities of scanning probe microscopes.

Latest Patents

One of Kurenuma's latest patents addresses the challenges faced when measuring patterns with steep side walls. In such cases, the probe can adhere to the side wall due to van der Waals forces, leading to errors in the measured profile. His invention proposes a method to detect this adhesion and temporarily increase the contact force between the probe and the sample. This allows the probe to reach the side wall bottom, enabling accurate measurements of high-aspect ratio patterns. Additionally, by analyzing the torsion data of the cantilever alongside the shape data of the pattern, Kurenuma's method corrects profile errors caused by probe adhesion.

Career Highlights

Throughout his career, Kurenuma has worked with prominent companies such as Hitachi Construction Machinery Co., Ltd. and Hitachi, Ltd. His experience in these organizations has contributed to his expertise in developing advanced measurement technologies.

Collaborations

Kurenuma has collaborated with notable colleagues, including Yukio Kembo and Shuichi Baba. Their combined efforts have furthered the advancements in the field of microscopy.

Conclusion

Toru Kurenuma's innovative work in scanning probe microscopy has significantly impacted the accuracy of measurements in complex patterns. His patents reflect a deep understanding of the challenges in the field and offer practical solutions to enhance measurement precision.

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