This inventor holds 1 USPTO granted patent. Top assignees: Hitachi Tobu Semiconductor, Hitachi, Ltd.. Active years: 1992.
Company Filing History:
1 out of 30 
1 out of 42,726 
Years Active: 1992
Title: The Innovations of Tooru Nagamine
Introduction: Tooru Nagamine is a notable inventor based in Takasaki, Japan. He has made significant contributions to the field of semiconductor technology. His work has led to advancements that enhance the reliability of semiconductor devices.
Latest Patents: One of Nagamine's key patents is titled "Resin-encapsulated semiconductor device having a particular mounting." This invention addresses the issue of resin cracking at the rear surface of surface-packaged resin packages during high-temperature soldering processes. By incorporating a through hole of large area in a die pad or tab, his design ensures the durability and reliability of resin-molded surface-packaged integrated circuits (ICs).
Career Highlights: Throughout his career, Tooru Nagamine has worked with prominent companies such as Hitachi, Ltd. and Hitachi Tobu Semiconductor. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.
Collaborations: Nagamine has collaborated with esteemed colleagues, including Toshihiro Yasuhara and Masachika Masuda. These partnerships have contributed to the advancement of his projects and the overall field of semiconductor devices.
Conclusion: Tooru Nagamine's contributions to semiconductor technology, particularly through his innovative patent, have established him as a significant figure in the industry. His work continues to influence the development of reliable electronic devices.