The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 1992
Filed:
Feb. 11, 1991
Applicant:
Inventors:
Toshihiro Yasuhara, Kokubunji, JP;
Masachika Masuda, Kodaira, JP;
Gen Murakami, Malhida, JP;
Kunihiko Nishi, Kokubunji, JP;
Masanori Sakimoto, Hinode, JP;
Ichio Shimizu, Tamamura, JP;
Akio Hoshi, Isesaki, JP;
Sumio Okada, Takasaki, JP;
Tooru Nagamine, Takasaki, JP;
Assignees:
Hitachi, Ltd., Tokyo, JP;
Hitachi Tobu Semiconductor, Ltd., Saitama, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 70 ; 357 72 ;
Abstract
The present invention consists in that a through hole of large area is provided in a die pad or a tab, thereby to prevent a resin from cracking at the rear surface of a surface-packaging resin package in a high-temperature soldering atmosphere of vapor-phase reflow or the like, whereby a resin-molded surface-packaged IC of high reliability is provided.