Sumio Okada

Title: Sumio Okada: Innovator in Semiconductor Technology

Introduction

Sumio Okada is a prominent inventor based in Takasaki, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work has been instrumental in advancing the manufacturing processes of semiconductor devices.

Latest Patents

Okada's latest patents include a process for manufacturing semiconductor integrated circuit devices. This innovative process involves molding a chip with an electric circuit and multiple leads in a resin-sealed package. The method introduces a molding compound sheet into the cavities of molds before clamping, melting the sheet into a liquid molding material, and setting it integrally. Another notable patent focuses on a resin-encapsulated semiconductor device designed to prevent cracking in high-temperature soldering environments. This invention features a large-area through hole in a die pad or tab, enhancing the reliability of surface-packaged ICs.

Career Highlights

Throughout his career, Okada has worked with leading companies in the semiconductor industry, including Hitachi, Ltd. and Hitachi Tobu Semiconductor. His experience in these organizations has allowed him to refine his expertise and contribute to groundbreaking innovations in semiconductor technology.

Collaborations

Okada has collaborated with notable colleagues such as Ichio Shimizu and Akio Hoshi. These partnerships have fostered a creative environment that has led to significant advancements in their field.

Conclusion

Sumio Okada's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry, paving the way for future innovations.