Tongsuk Kim

Title: Tongsuk Kim: Innovator in Semiconductor Packaging

Introduction

Tongsuk Kim is a prominent inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work focuses on innovative designs that enhance the functionality and efficiency of semiconductor devices.

Latest Patents

Tongsuk Kim's latest patents include a groundbreaking semiconductor package design. This design features a package substrate with a top surface and a bottom surface, where a semiconductor chip is mounted on the top surface. The package includes a power block and a ground block, which serve as pathways penetrating the substrate. Additionally, the design incorporates first and second vias that connect to the semiconductor chip, ensuring efficient electrical pathways. Another notable patent involves a semiconductor package that includes a chip mounting region and a peripheral region, with a ground layer formed in the peripheral region. This package design also features solder balls and a package cap that covers the semiconductor chip, enhancing its protection and functionality.

Career Highlights

Tongsuk Kim is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to the company's innovative product offerings.

Collaborations

Throughout his career, Tongsuk Kim has collaborated with talented individuals such as Heeseok Lee and Jangwoo Lee. These collaborations have fostered a creative environment that has led to the development of advanced semiconductor packaging solutions.

Conclusion

Tongsuk Kim's contributions to semiconductor packaging demonstrate his innovative spirit and commitment to advancing technology. His patents reflect a deep understanding of the complexities involved in semiconductor design, making him a valuable asset in the field.