This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Tong Suk Kim and Semiconductor Packaging Innovation.
Introduction
Tong Suk Kim is an inventor associated with Suwon, South Korea, and Samsung Electronics Ltd. His listed patent record includes 1 patent concerning semiconductor packaging.
Latest Patents
The patent, “Semiconductor Package Including an Edge Region Having a Plurality of Solder Balls Therein,” describes a package with a ball array region on the lower surface of a first structure. The region includes a passive element area without solder balls, surrounded by an edge region containing a ball array. At least two power solder balls in that array supply power to the passive element, the first semiconductor chip, or both.
Career Highlights
Kim’s listed invention addresses the arrangement of solder balls and passive components in a semiconductor package. The design distinguishes the passive element region from the surrounding edge region and places power-supplying solder balls in that edge region.
Collaborations
The provided information lists Sang Woong Lee and Shle-ge Lee as Kim’s coworkers. It does not specify their roles or whether they collaborated on this patent.
Conclusion
Tong Suk Kim’s listed patent reflects work on semiconductor package design, particularly the placement of passive elements and power solder balls.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile