Chengdu, China

Tong Jiao

This inventor holds 1 USPTO granted patent. Top assignee: Chengdu University of Technology. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tong Jiao. Retrieved from https://idiyas.com/inventor/tong-jiao-ql4w2qau

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Innovations of Tong Jiao in Geotechnical Engineering

Introduction

Tong Jiao is a prominent inventor based in Chengdu, China. He has made significant contributions to the field of geotechnical engineering through his innovative inventions. His work focuses on developing advanced sensors that enhance the measurement and analysis of geotechnical deformations.

Latest Patents

Tong Jiao holds a patent for a "Coaxial waveguide-based geotechnical multi-point deformation sensor and method of adjustable gauge-length measurement." This invention provides a novel approach to measuring deformation in geotechnical layers. The sensor consists of an outer conductor, magnetic metal support frames, an inner conductor, and annular magnets. By reconstructing the interference spectra from reflection points, the sensor can accurately determine the deformation of geotechnical layers.

Career Highlights

Tong Jiao is affiliated with Chengdu University of Technology, where he continues to advance research in geotechnical engineering. His innovative work has garnered attention in academic and professional circles, contributing to the development of more effective measurement techniques in the field.

Collaborations

Some of his notable coworkers include Qiang Xu and Xing Zhu. Their collaborative efforts have further enhanced the research and development of geotechnical sensors.

Conclusion

Tong Jiao's contributions to geotechnical engineering through his innovative sensor technology demonstrate his commitment to advancing the field. His work not only improves measurement techniques but also enhances our understanding of geotechnical deformations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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