Tokyo, Japan

Tomoyuki Abe

This inventor holds 6 USPTO granted patents and 3 published patent applications and 1 EPO patent. Top assignees: Dexerials Corporation, Kabushiki Kaisha Square Enix. Active years: 2017-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tomoyuki Abe. Retrieved from https://idiyas.com/inventor/tomoyuki-abe-fb3by794

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6 

% Patents Active = 100.0

 

Average Co-Inventor Count = 2.2

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2017-2026

Loading Chart...
Loading Chart...
6 patents (USPTO):Explore Patents

Title: Innovations of Tomoyuki Abe

Introduction

Tomoyuki Abe is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of technology, particularly in the development of connection bodies and smart card manufacturing. With a total of four patents to his name, Abe's work showcases his innovative approach to solving complex engineering challenges.

Latest Patents

Abe's latest patents include a connection body and a method for manufacturing the connection body. This invention focuses on achieving fine pitch and miniaturization in connection bodies. The connection body consists of a substrate with a first terminal array and a connector with a second terminal array. An adhesive layer, formed by curing a thermosetting connection material, connects these arrays. The design allows for a level difference canceling portion, which helps in minimizing the level difference in the bottom surface. The thermosetting connection material contains solder particles and a flux component, enabling a fine pitch connection and miniaturization of the connected body.

Another significant patent is a method for manufacturing a smart card. This method enhances connection reliability and bending resistance. It involves a conductive particle-containing hot-melt adhesive sheet that includes solder particles of a non-eutectic alloy. This sheet is interposed between a card member and an IC chip, followed by thermocompression bonding. The use of a crystalline polyamide with a carboxyl group improves solder wettability, ensuring excellent connection reliability and preventing a decrease in the elastic modulus of the adhesive layer.

Career Highlights

Throughout his career, Tomoyuki Abe has worked with prominent companies such as Dexerials Corporation and Kabushiki Kaisha Square Enix. His experience in these organizations has contributed to his expertise in innovative technologies and product development.

Collaborations

Abe has collaborated with talented individuals in his field, including Ryosuke Odaka and Hiroyuki Kumakura. These collaborations have likely fostered a creative environment that encourages the exchange of ideas and advancements in technology.

Conclusion

Tomoyuki Abe's contributions to the field of technology through his patents and career achievements highlight his role as an influential inventor. His innovative methods in connection body and smart card manufacturing demonstrate his commitment to advancing engineering solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…