The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2025
Filed:
Mar. 18, 2021
Dexerials Corporation, Shimotsuke, JP;
Ryosuke Odaka, Tochigi, JP;
Ryo Ito, Tochigi, JP;
Hiroyuki Kumakura, Tochigi, JP;
Tomoyuki Abe, Tochigi, JP;
Daisuke Sato, Tochigi, JP;
Katsuhisa Orihara, Tochigi, JP;
Kazuhisa Aoki, Tochigi, JP;
DEXERIALS CORPORATION, Shimotsuke, JP;
Abstract
A connection body capable of achieving fine pitch and miniaturization, and a method of manufacturing the connection body. A connection body includes: a substrate having a first terminal array; a connector having second terminal array; and an adhesive layer formed by curing a thermosetting connection material connecting the first terminal array and the second terminal array, wherein the second terminal array is disposed on the bottom surface of the connector and forms a level difference canceling portion for canceling a level difference in the bottom surface, and wherein the thermosetting connection material contains solder particles and a flux component. Thus, the first terminal array and the second terminal array can be connected, so that the terminal array can be made to have a fine pitch, and the connected body can be miniaturized.