This inventor holds 4 USPTO granted patents and 4 published patent applications. Top assignee: Ibiden Company Limited. Active years: 2016-2024.
Company Filing History:
Years Active: 2016-2024
Title: Tomoya Daizo: Innovator in Wiring Substrate Technology
Introduction
Tomoya Daizo is a prominent inventor based in Ogaki, Japan. He has made significant contributions to the field of wiring substrate technology, holding a total of 4 patents. His innovative approaches have paved the way for advancements in manufacturing processes.
Latest Patents
One of Tomoya's latest patents is a method for manufacturing a wiring substrate. This method involves forming multiple conductor pads on an insulating layer, which includes both first and second conductor pads. The process also includes creating protruding parts on the surfaces of the first conductor pads, followed by the formation of a resin layer that covers the insulating layer and the conductor pads. The resin layer exposes end portions of the protruding parts and includes multiple openings that reveal the surfaces of the second conductor pads. Additionally, a coating film is formed on these exposed surfaces.
Another notable patent is for a wiring substrate that features a metal post offset from the conductor pad. This invention includes a resin insulating layer and a via conductor that penetrates through the layer. A conductor pad is connected to the via conductor, and a coating insulating layer covers the conductor pad. The design ensures that the central axes of the conductor pad and the metal post are shifted in a predetermined direction, enhancing the functionality of the wiring substrate.
Career Highlights
Tomoya Daizo is currently employed at Ibiden Company Limited, where he continues to innovate in the field of wiring substrates. His work has been instrumental in developing advanced manufacturing techniques that improve the efficiency and reliability of electronic components.
Collaborations
Throughout his career, Tomoya has collaborated with notable colleagues, including Isao Ohno and Yoji Sawada. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.
Conclusion
Tomoya Daizo's contributions to wiring substrate technology exemplify his dedication to innovation and excellence. His patents reflect a deep understanding of manufacturing processes and a commitment to advancing the field.