Kariya, Japan

Tomoki Kawazu

This inventor holds 1 USPTO granted patent and 5 published patent applications and 2 EPO patents. Top assignee: Denso Corporation. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tomoki Kawazu. Retrieved from https://idiyas.com/inventor/tomoki-kawazu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

 

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Tomoki Kawazu

Introduction

Tomoki Kawazu is a notable inventor based in Kariya, Japan. He has made significant contributions to the field of semiconductor manufacturing. His innovative approach has led to the development of a unique method for producing semiconductor wafers.

Latest Patents

Kawazu holds 1 patent for his invention titled "Method of manufacturing semiconductor wafers." This patent describes a manufacturing method that involves preparing an ingot with a peeling layer formed along its first major surface. The process includes applying a load to the ingot to facilitate the peeling of a wafer precursor, which is crucial for semiconductor production.

Career Highlights

Tomoki Kawazu is associated with Denso Corporation, a leading company in the automotive industry. His work at Denso has allowed him to focus on advancing semiconductor technologies, which are essential for modern electronic devices.

Collaborations

Kawazu has collaborated with talented coworkers such as Sodai Nomura and Bahman Hossini Soltani. Their combined expertise has contributed to the success of various projects within the company.

Conclusion

Tomoki Kawazu's innovative methods in semiconductor wafer manufacturing highlight his significant role in advancing technology. His contributions continue to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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