Tokyo, Japan

Tomohiro Shimokawaji

This inventor holds 1 USPTO granted patent. Top assignee: Nippon Mektron Limited. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tomohiro Shimokawaji. Retrieved from https://idiyas.com/inventor/tomohiro-shimokawaji

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Tomohiro Shimokawaji: Innovator in Flexible Printed Board Technology

Introduction

Tomohiro Shimokawaji is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of flexible printed board technology. His innovative approach has led to the development of a unique product that enhances heat dissipation performance.

Latest Patents

Shimokawaji holds a patent for a flexible printed board and a method for manufacturing it. This invention improves heat dissipation without the use of aluminum heat dissipating materials. The flexible printed board is lightweight, cost-effective, and possesses excellent processability. It features a front surface heat dissipation layer made of copper foil, a thermally conductive resin layer, and a rear surface heat dissipation layer, also made of copper foil.

Career Highlights

Shimokawaji is currently employed at Nippon Mektron Limited, where he continues to innovate in the field of electronics. His work focuses on enhancing the performance and efficiency of flexible printed boards, which are essential components in various electronic devices.

Collaborations

He collaborates with talented coworkers, including Satoshi Ebihara and Takahisa Kato, to further advance their projects and share knowledge within their field.

Conclusion

Tomohiro Shimokawaji's contributions to flexible printed board technology exemplify the spirit of innovation. His patent reflects a commitment to improving electronic components, making them more efficient and cost-effective.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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