The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2019
Filed:
Jun. 21, 2017
Nippon Mektron, Ltd., Tokyo, JP;
Satoshi Ebihara, Tokyo, JP;
Takahisa Kato, Tokyo, JP;
Nobuto Sasaki, Tokyo, JP;
Kazuyuki Azuma, Tokyo, JP;
Tomohiro Shimokawaji, Tokyo, JP;
Takeo Wakabayashi, Tokyo, JP;
NIPPON MEKTRON, LTD., Tokyo, JP;
Abstract
Provided are both a flexible printed board, in which heat dissipation performance can be improved in without using an aluminum heal dissipating material, which is light in weight, has good processability and can be reduced in cost, and a method for manufacturing such a flexible printed board. The flexible printed board is a flexible printed boardon which a power consuming load is mounted, including: a front surface heat dissipation layermade of a copper foil and having a circuit portion on which the load is mounted; a thermally conductive resin layerhaving the front surface heat dissipation layerlaminated to a front surface side thereof and having a thermal conductivity of 0.49 W/mK or more; and a rear surface heat dissipation layer made of a copper foil, laminated to a rear surface side of the thermally conductive resin layer, and having a thickness of 100 to 400% with respect to the front surface heat dissipation layer