Kasugai, Japan

Tomohiro Maeda

This inventor holds 1 USPTO granted patent. Top assignees: Kisoh Co., Ltd., Tokyo Ohka Kogyo Co., Ltd.. Active years: 2023.


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Tomohiro Maeda: Innovator in Cladding Composition Technology

Introduction

Tomohiro Maeda is a notable inventor based in Kasugai, Japan. He has made significant contributions to the field of materials science, particularly in the development of cladding compositions. His innovative work has led to the creation of a patented method that enhances the bonding of metal and resin materials.

Latest Patents

Maeda holds a patent for a cladding composition and a method for producing a metal/resin bonded member. This invention provides a cladding composition that includes metal powder, a binder, and an organic solvent, which is essential for effectively bonding a metal base material to a resin member. The patented method involves several steps, including coating the metal base material with the cladding composition, irradiating it with a laser, and subsequently bonding the resin member through a heating process at the interface.

Career Highlights

Throughout his career, Tomohiro Maeda has worked with prominent companies such as Kisoh Co., Ltd. and Tokyo Ohka Kogyo Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in material bonding technologies.

Collaborations

Maeda has collaborated with notable colleagues, including Takeshi Iwai and Mamoru Hosoya. These partnerships have fostered an environment of innovation and have led to the successful development of new technologies in the field.

Conclusion

Tomohiro Maeda's contributions to cladding composition technology exemplify the impact of innovative thinking in materials science. His patented methods and collaborations highlight the importance of teamwork in advancing technological solutions.

Profile summary based on public USPTO records.
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