This inventor holds 2 USPTO granted patents. Top assignee: Ibiden Company Limited. Active years: 2022-2024.
Company Filing History:
Years Active: 2022-2024
Title: Innovations of Tomohiro Fuwa
Introduction
Tomohiro Fuwa is a notable inventor based in Ogaki, Japan. He has made significant contributions to the field of electronic components, particularly in the development of innovative wiring boards. With a total of 2 patents to his name, Fuwa continues to push the boundaries of technology.
Latest Patents
Fuwa's latest patents include an electronic component built-in wiring board and a method for manufacturing the same. This invention features a substrate with a cavity that accommodates an electronic component. The component has pads on its surface, and a coating insulating layer is formed on the substrate, covering the component and featuring via holes. Via conductors are created in these holes, penetrating through the insulating layer. Additionally, a resin coating is positioned between the component and the insulating layer, containing through holes that partially expose the pads in the via holes. This innovative design ensures that the adhesion of the coating to the component is stronger than that of the insulating layer. The via conductors connect to the pads on the surface of the component, enhancing the functionality of the wiring board.
Career Highlights
Tomohiro Fuwa is currently employed at Ibiden Company Limited, where he continues to innovate in the field of electronic components. His work has been instrumental in advancing the technology used in wiring boards, making them more efficient and reliable.
Collaborations
Fuwa collaborates with talented coworkers such as Yuichi Nakamura and Keinosuke Ino. Their combined expertise contributes to the innovative projects at Ibiden Company Limited.
Conclusion
Tomohiro Fuwa's contributions to the field of electronic components through his patents and collaborations highlight his role as a significant inventor. His work continues to influence the industry and pave the way for future innovations.
