Tomochika Tominaga

Title: **Innovator Spotlight: Tomochika Tominaga**

Introduction

Tomochika Tominaga, an accomplished inventor based in Isahaya, Japan, has made significant contributions to the field of semiconductor processing. With a total of three patents to his name, Tominaga's innovations are making waves in the technology sector, specifically in enhancing the manufacturing processes of semiconductor devices.

Latest Patents

His latest patented invention focuses on an innovative pressure-sensitive adhesive tape for semiconductor processing. This novel adhesive tape plays a crucial role in the grinding process of semiconductor wafers, particularly those with grooves formed on their front faces or modified regions. The design includes a base, a buffer layer on one side, and a pressure-sensitive adhesive layer on the other. Notably, the invention stays within defined specifications, including a ratio (D2/D1) of the buffer layer's thickness to that of the base being 0.7 or less and an indentation depth on the buffer layer side not exceeding 2.5 micrometers. These advancements aim to improve efficiency and precision in the production of semiconductor chips.

Career Highlights

Tomochika Tominaga has been pivotal in advancing adhesive technologies while working at Lintec Corporation. His work not only highlights his technical expertise but also demonstrates a commitment to pushing the boundaries of semiconductor manufacturing practices.

Collaborations

Throughout his career, Tominaga has collaborated with notable colleagues, including Katsuhiko Horigome and Kazuyuki Tamura. These partnerships have fostered an innovative environment, crucial for developing transformative technologies in the semiconductor domain.

Conclusion

With his innovative spirit and dedication, Tomochika Tominaga stands out as a significant figure in the semiconductor industry. His contributions through patents and collaborations are paving the way for future advancements, underscoring the importance of innovation in technology.