Tokyo, Japan

Tomoaki Nishino

USPTO Granted Patents = 2 


Average Co-Inventor Count = 5.8

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2019-2021

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2 patents (USPTO):

Title: Tomoaki Nishino: Innovator in Soldering Materials

Introduction

Tomoaki Nishino is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of soldering materials, holding a total of 2 patents. His innovative work focuses on improving the reliability and performance of soldering materials used in electronic components.

Latest Patents

Nishino's latest patents include a novel soldering material designed to minimize oxidation. This invention features a Cu core ball that consists of a Cu ball of predetermined size, coated with a solder layer. The Cu ball creates a space between a semiconductor package and a printed circuit board. The soldering material exhibits a lightness greater than or equal to 62.5 in the L*a*b* color space after undergoing a heating storage test at 150°C for 72 hours. Prior to this test, the material's lightness is greater than or equal to 65, with a yellowness of less than or equal to 7.0.

Another significant patent involves a core material that includes a core and a solder plating layer made from a (Sn–Bi)-based solder alloy. This layer is characterized by a homogeneous distribution of Bi, with a concentration ratio maintained within a specific range. This innovation ensures consistent performance across the entire solder plating layer.

Career Highlights

Tomoaki Nishino is currently employed at Senju Metal Industry Co., Ltd., where he continues to develop advanced soldering materials. His work has been instrumental in enhancing the quality and durability of electronic components.

Collaborations

Nishino collaborates with notable colleagues, including Hiroyoshi Kawasaki and Takahiro Roppongi. Their combined expertise contributes to the innovative advancements in their field.

Conclusion

Tomoaki Nishino's contributions to soldering materials reflect his dedication to innovation and quality in electronics. His patents demonstrate a commitment to improving the reliability of electronic components, making a significant impact in the industry.

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