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For the Inventor, By the Inventor

Annaka, Japan

Tomoaki Nakamura

This inventor holds 8 USPTO granted patents and 6 published patent applications and 1 EPO patent. Top assignee: Shin-Etsu Chemical Co., Ltd.. Active years: 2015-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tomoaki Nakamura. Retrieved from https://idiyas.com/inventor/tomoaki-nakamura-ol06icch

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 8 

% Patents Active = 100.0


Average Co-Inventor Count = 3.6

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:

goldMedal8 out of 5,989 
 
Shin-Etsu Chemical Co., Ltd.
 patents

Years Active: 2015-2019

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8 patents (USPTO):Explore Patents
1. 10385203 - Heat-curable resin composition for semiconductor encapsulation (2019-08-20),
2. 10242924 - Base-attached encapsulant for semiconductor encapsulation, semiconductor apparatus (2019-03-26),
3. 10177059 - Method for manufacturing semiconductor apparatus using a base-attached encapsulant (2019-01-08),
4. 9865518 - Electromagnetic wave shielding support base-attached encapsulant, encapsulated substrate having semicondutor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, and semiconductor apparatus (2018-01-09),
5. 9449856 - Encapsulant with base for use in semiconductor encapsulation, semiconductor apparatus, and method for manufacturing semiconductor apparatus (2016-09-20),
6. 9312197 - Support base-attached encapsulant, encapsulated substrate having semiconductor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, semiconductor apparatus, and method for manufacturing semiconductor apparatus (2016-04-12),
7. 9287174 - Fiber-containing resin substrate, device-mounting substrate and device-forming wafer, semiconductor apparatus, and method for producing semiconductor apparatus (2016-03-15),
8. 9129912 - Encapsulant, encapsulated substrate having semiconductor devices mounting thereon, encapsulated wafer having semiconductor devices forming thereon, semiconductor apparatus, and method for manufacturing semiconductor apparatus (2015-09-08),

Title: Tomoaki Nakamura: Pioneering Inventor from Annaka, JP

Introduction: Tomoaki Nakamura is a renowned inventor hailing from Annaka, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Tomoaki Nakamura holds several patents in the areas of robotics, artificial intelligence, and sustainable energy solutions, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Nakamura has worked with leading tech companies in Japan, spearheading projects that have revolutionized industries and improved the quality of life for many.

Collaborations: Throughout his career, Tomoaki Nakamura has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge-sharing.

Conclusion: Tomoaki Nakamura's passion for innovation and his relentless drive to push the boundaries of what is possible make him a true trailblazer in the world of inventions. His work continues to inspire future generations of inventors worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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