The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2019
Filed:
Aug. 30, 2017
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 61/06 (2006.01); C08K 9/06 (2006.01); C08K 5/17 (2006.01); C08K 3/36 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); C08G 73/06 (2006.01); C08G 14/12 (2006.01);
U.S. Cl.
CPC ...
C08L 61/06 (2013.01); C08G 73/0655 (2013.01); C08K 3/36 (2013.01); C08K 5/175 (2013.01); C08K 9/06 (2013.01); H01L 21/565 (2013.01); H01L 23/293 (2013.01); H01L 23/295 (2013.01); H01L 23/296 (2013.01); C08G 14/12 (2013.01); C08K 2201/003 (2013.01);
Abstract
Provided is a highly versatile heat-curable resin composition for semiconductor encapsulation that exhibits a favorable water resistance and abradability when used to encapsulate a semiconductor device; and a superior fluidity and a small degree of warpage even when used to perform encapsulation on a large-sized wafer. The heat-curable resin composition for semiconductor encapsulation comprises: