Shizuoka, Japan

Tomio Tsuchiya

This inventor holds 2 USPTO granted patents. Top assignee: Fuji Seiki Machine Works, Ltd.. Active years: 1988-1989.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tomio Tsuchiya. Retrieved from https://idiyas.com/inventor/tomio-tsuchiya

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 2

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 1988-1989

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2 patents (USPTO):Explore Patents

Title: The Innovations of Tomio Tsuchiya

Introduction

Tomio Tsuchiya is a notable inventor based in Shizuoka, Japan. He has made significant contributions to the field of soldering technology, holding a total of 2 patents. His work focuses on improving the efficiency and effectiveness of soldering processes in electronic manufacturing.

Latest Patents

One of Tsuchiya's latest patents is the "Solder Coating Apparatus." This innovative soldering machine is designed to apply liquid solder simultaneously to opposite sides of the leads of a lead frame that contains integrated circuit (I.C.) devices. The apparatus features sidewardly spaced rolls that create a vertically extending narrow nip through which the lead frame passes. A solder bath is positioned below the rolls, allowing the lower portions to dip into the bath and carry a solder film to the nip for application. Additionally, a passage extends upwardly in isolation from the bath, enabling the lead frame to be fed vertically through the nip.

Another significant patent is the "Lead Frame Finishing Apparatus." This device consists of a tool supporting base equipped with multiple lead frame finishing tools. It includes two frames that support a lead frame transfer unit, which clamps the lead frames at their edges and is adjustable. A linkage unit connects one of the frames to the tool supporting base, allowing it to pivot around a pin. This design ensures that the effective width covered by the tools corresponds to the width between the two frames that support the lead frame transfer unit.

Career Highlights

Tomio Tsuchiya is currently associated with Fuji Seiki Machine Works, Ltd., where he continues to innovate in the field of soldering technology. His work has been instrumental in enhancing the manufacturing processes of electronic components.

Conclusion

Tomio Tsuchiya's contributions to soldering technology through his patents demonstrate his commitment to innovation in the electronics industry. His inventions are paving the way for more efficient manufacturing processes, showcasing the importance of continuous improvement in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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