Fuji Seiki Machine Works, Ltd.

Tomio Tsuchiya

A soldering machine for simultaneously applying liquid solder to opposite sides of the leads of a lead frame having I.C. devices thereon. The machine has sidewardly spaced rolls which define a vertically extending narrow nip therebetween through which the lead frame passes. A solder bath is disposed below the rolls so that the lower portions of the rolls dip into the bath and carry a solder film to the nip for application to opposite sides of the leads. A passage extends upwardly in isolation from the bath for permitting the lead frame to be fed vertically through the nip.

Solder coating apparatus

A lead frame finishing apparatus comprises a tool supporting base on which a plurality of lead frame finishing tools are provided. Two frames support a lead frame transfer unit which clamps the lead frames at their edges and has an adjustable. A linkage unit connects one of the frames to the tool supporting base and pivots the tool supporting base around a pin to correspond the effective width covered by the tools to the width between the two frames which support the lead frame transfer unit.

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Shizuoka, Japan

Tomio Tsuchiya