Helsingin yliopisto, Finland

Tom Sillanpää

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Helsingin Yliopisto. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tom Sillanpää. Retrieved from https://idiyas.com/inventor/tom-sillanpää

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Tom Sillanpää and Ultrasound-Based Sampling Innovation.

Introduction

Tom Sillanpää is an inventor associated with the University of Helsinki in Finland. His patent work concerns a sampling system that uses high-intensity focused ultrasound to remove material from a sample immersed in fluid.

Latest Patents

Sillanpää is associated with 1 patent: “System and method for sampling.” The invention uses cavitation induced by high-intensity focused ultrasound to remove material from a sample. A feeding unit transports at least part of the removed material from the fluid to a detecting unit. The patent also describes a method for feeding material from the sample to the detecting unit using the system.

Career Highlights

Sillanpää’s listed innovation connects focused ultrasound sampling with material transport and detection. The approach is designed to collect material from a sample while it is immersed in fluid and deliver that material for analysis.

Collaborations

His listed coworkers include Ari Salmi and Axi Holmström. Sillanpää is associated with the University of Helsinki.

Conclusion

Tom Sillanpää’s patent describes an ultrasound-based sampling system that removes material through cavitation and conveys it to a detecting unit.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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