Kyoto, Japan

Tokuzan Miyake

USPTO Granted Patents = 4 

 

Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2017-2020

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4 patents (USPTO):Explore Patents

Title: The Innovations of Tokuzan Miyake

Introduction

Tokuzan Miyake is a notable inventor based in Kyoto, Japan. He has made significant contributions to the field of materials science, particularly in the development of solder resist compositions and printed wiring boards. With a total of four patents to his name, Miyake's work has had a considerable impact on the electronics industry.

Latest Patents

Miyake's latest patents include a liquid solder resist composition and a covered-printed wiring board. The liquid solder resist composition features a carboxyl group-containing resin, a photopolymerizable compound, and a photopolymerization initiator that includes both bisacylphosphine oxide-based and α-hydroxyalkyl phenone-based initiators. This innovative composition is designed to enhance the performance and reliability of electronic components. Additionally, his solder resist composition incorporates a fluorescent dye, further improving its functionality in printed wiring applications.

Career Highlights

Miyake is currently employed at Goo Chemical Company, Ltd., where he continues to advance his research and development efforts. His work has been instrumental in creating materials that meet the evolving demands of the electronics sector. His expertise in photopolymerization and resin technology has positioned him as a key figure in his field.

Collaborations

Miyake has collaborated with several talented individuals, including Yoshio Sakai and Nobuhito Hamada. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Tokuzan Miyake's contributions to the field of materials science and his innovative patents have significantly influenced the electronics industry. His ongoing work at Goo Chemical Company, Ltd. continues to pave the way for advancements in solder resist technologies.

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