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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10527937 B1

PDFFull Text
Date of Patent:
Jan. 07, 2020

Filed:

Nov. 07, 2017

Liquid solder resist composition and covered-printed wiring board

Applicant:

Goo Chemical Co., Ltd., Kyoto, JP;

Inventors:

Yoshio Sakai, Shiga, JP;

Nobuhito Hamada, Kyoto, JP;

Michiya Higuchi, Kyoto, JP;

Tokuzan Miyake, Kyoto, JP;

Assignee:

GOO CHEMICAL CO., LTD., Kyoto, JP;

Attorney:

Cheng Law Group, PLLC

Primary Examiner:

Martin J Angebranndt

Int. Cl.
CPC ...
G03F 7/031 (2006.01); G03F 7/038 (2006.01); G03F 7/20 (2006.01); G03F 7/004 (2006.01); G03F 7/029 (2006.01); G03F 7/32 (2006.01); H05K 3/28 (2006.01); H05K 1/02 (2006.01); G03F 7/26 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
G03F 7/031 (2013.01); G03F 7/0042 (2013.01); G03F 7/0043 (2013.01); G03F 7/029 (2013.01); G03F 7/038 (2013.01); G03F 7/0385 (2013.01); G03F 7/0388 (2013.01); G03F 7/20 (2013.01); G03F 7/2006 (2013.01); G03F 7/26 (2013.01); G03F 7/322 (2013.01); H05K 1/02 (2013.01); H05K 1/0274 (2013.01); H05K 1/0353 (2013.01); H05K 3/282 (2013.01); H05K 3/287 (2013.01); H05K 2201/0166 (2013.01); H05K 2201/068 (2013.01);
Abstract

A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first α-hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25° C., and a second α-hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25° C.

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