IDiyas

For the Inventor, By the Inventor

Hitachi, Japan

Tohru Kikuchi

USPTO Granted Patents = 13

Average Co-Inventor Count = 4.0

ph-index = 7

Forward Citations = 156(Granted Patents)


Company Filing History:

goldMedal13 out of 1,641 
 
Hitachi Chemical Company, Ltd.
 patents

Years Active: 1990-1994

Loading Chart...
13 patents (USPTO):Explore Patents
1. 5350811 - Epoxy resin and adhesive composition containing the same (1994-09-27),
2. 5262277 - Photosensitive resin composition and photosensitive element using the (1993-11-16),
3. 5258139 - Epoxy resin and adhesive composition containing the same (1993-11-02),
4. 5242917 - Tetracarboxylic acid dianhydride having disiloxane linkage and process (1993-09-07),
5. 5166363 - Process for producing 1,3-bis(dicarboxyphenyl)-disiloxane derivative or (1992-11-24),
6. 5164816 - Integrated circuit device produced with a resin layer produced from a (1992-11-17),
7. 5102962 - Phenolic polymer and production thereof (1992-04-07),
8. 5087658 - Heat-resistant resin paste and integrated circuit device produced by (1992-02-11),
9. 5055593 - 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetraphenyldisiloxane derivative, (1991-10-08),
10. 4968759 - Phenolic polymer and production thereof (1990-11-06),
11. 4958001 - Dicyclohexyl-3,4,3',4'-tetracarboxylic acid or dianhydride thereof and (1990-09-18),
12. 4912233 - Para- or meta-terphenyltetracarboxylic acid, dianhydride thereof and (1990-03-27),
13. 4897438 - Stabilized synthetic resin composition (1990-01-30),

Title: Tohru Kikuchi: Innovator in Adhesive and Photosensitive Technologies

Introduction

Tohru Kikuchi is a prominent inventor based in Hitachi, Japan, known for his significant contributions to the fields of adhesive and photosensitive technologies. With a total of 13 patents to his name, Kikuchi has made remarkable advancements that have impacted various industries, particularly in semiconductor manufacturing.

Latest Patents

Kikuchi's latest patents include an innovative epoxy resin and adhesive composition designed for bonding semiconductor chips to copper frames. This adhesive composition features an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane dianhydride with an alcohol or alcohol derivative, followed by reaction with an epoxy compound having two or more epoxy groups. The formulation is particularly noted for its ability to minimize warpage of the chips during the bonding process. Another notable patent is a photosensitive resin composition that comprises a polymer obtained by reacting an isocyanate compound with a polymer that is a reaction product of a tetracarboxylic acid dianhydride and a diamine. This composition, along with a photoinitiator, provides a thick film with excellent heat resistance, adhesiveness, flexibility, and mechanical properties, making it suitable for producing high-quality photosensitive elements.

Career Highlights

Kikuchi is currently associated with Hitachi Chemical Company, Ltd., where he continues to develop innovative materials and technologies. His work has not only advanced the capabilities of adhesive applications but has also contributed to the enhancement of photosensitive materials used in various electronic devices.

Collaborations

Throughout his career, Kikuchi has collaborated with notable colleagues, including Takayuki Saito and Hiroyuki Kawakami. These collaborations have fostered a creative environment that has led to the development of cutting-edge technologies in their respective fields.

Conclusion

Tohru Kikuchi's contributions to adhesive and photosensitive technologies have established him as a key figure in innovation. His patents reflect a commitment to advancing materials science, particularly in the semiconductor industry. His work continues to influence the development of new technologies that enhance product performance and reliability.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…