Hitachi Chemical Company, Ltd.

Tohru Kikuchi

Takayuki Saito

Hiroyuki Kawakami

Hidetaka Sato

Toshiyuki Fujita

Hiroshi Nishizawa

Kenji Suzuki

Yoshiyuki Mukoyama

Koichi Kamijima

Mitsuo Yamazaki

Mitsumasa Kojima

Hidetaka Satou

Nobuo Ichimura

Masao Kawasumi

Yasuo Miyamoto

Kohei Fujita

Yutaka Nakahara

Nobuyuki Hayashi

Hiroshi Suzuki

Toshiaki Ishimaru

Shigeo Tachiki

Yasunori Kojima

Akihiro Sasaki

Hiroshi Takahashi

Kuniaki Sato

Masaki Yagi

An adhesive composition comprising (a) an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane dianhydride with an alcohol or alcohol derivative, followed by reaction with an epoxy compound having two or more epoxy groups, or an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane with an epoxy compound having two or more epoxy groups and (b) a curing agent is suitable for bonding semiconductor chips to a copper frame with a small warpage of the chips.

Epoxy resin and adhesive composition containing the same

A photosensitive resin composition comprising (A) a polymer obtained by reacting an isocyanate compound having an ethylenic unsaturated group with a polymer which is a reaction product of a tetracarboxylic acid dianhydride and a diamine, and (B) a photoinitiator, can provide a thick film excellent in heat resistant, adhesiveness, flexibility, electrical and mechanical properties, and is particularly suitable for producing a photosensitive element.

Photosensitive resin composition and photosensitive element using the

An adhesive composition comprising (a) an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubustituted disiloxane dianhydride with an alcohol or alcohol derivative, followed by reaction with an epoxy compound having two or more epoxy groups, or an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane with an epoxy compound having two or more epoxy groups and (b) a curing agent is suitable for bonding semiconductor chips to a copper frame with a small warpage of the chips.

1-(2,3-Dicarboxyphenyl)-3-(3,4-dicarboxyphenyl)-1,1,3,3-tetramethyldisiloxa ne dianhydride is useful as a curing agent for epoxy resins.

Tetracarboxylic acid dianhydride having disiloxane linkage and process

A process for producing (i) a 1,3-bis(dicarboxyphenyl)disiloxane derivative represented by the general formula ##STR1## wherein Rs and R's independently of one another denote methyl or phenyl or (ii) a 1,3-bis(dicarboxyphenyl)-disiloxane derivative dianhydride represented by the general formula ##STR2## wherein Rs and R's are as defined above, the process comprising coupling a Grignard reagent of halo-o-xylene with a disubstituted halosilane represented by the general formula ##STR3## wherein R and R' are as defined above and X denotes halogen, to form a dimethylphenyl(disubstituted silane) represented by the general formula ##STR4## wherein R and R' are as defined above, hydroxylating the dimethylphenyl(disubstituted silane) to form a dimethylphenyl(disubstituted hydroxysilane) represented by the general formula ##STR5## wherein R and R' are as defined above, to form a 1,3-bis(dimethylphenyl)-disilane

Process for producing 1,3-bis(dicarboxyphenyl)-disiloxane derivative or

An integrated circuit device wherein layer insulation is attained by at least one of (i) an insulator layer interposed between two adjacent conductor layers, and (ii) a surface protecting layer fixedly covering the surface of the semiconductor chip, each of the insulator layer and the surface protecting layer being made of a heat-resistant resin obtainable by heating a heat-resistant resin paste. Said paste consists essentially of a first organic liquid, a second organic liquid, a heat-resistant resin (B) which is soluble in an organic liquid mixture consisting of the first organic liquid and the second organic liquid, and fine particles of a heat-resistant resin (C) which is soluble in the first organic liquid but insoluble in the second organic liquid. The first organic liquid, the second organic liquid and the heat-resistant resin (B) are brought into a solution in which the fine particles of a heat-resistant resin (C) are dispersed.

Integrated circuit device produced with a resin layer produced from a

A phenolic polymer obtained by reacting a phenolic compound with a bis(hydroxyalkyl)benzene, followed by alkylation of ortho positions or para position with respect to the hydroxyl group of the terminal phenol groups of the produced polymer is suitable for use as a heat resistant antioxidant for thermoplastic resins.

Phenolic polymer and production thereof

A heat-resistant resin paste consisting essentially of a first organic liquid (A.sub.1), a second organic liquid (A.sub.2), a heat-resistant resin (B) which is soluble in an organic liquid mixture consisting essentially of the first organic liquid (A.sub.1) and the second organic liquid (A.sub.2), and fine particles of a heat-resistant resin (C) which are soluble in the first organic liquid (A.sub.1), but insoluble in the second organic liquid (A.sub.2). The first organic liquid (A.sub.1), the second organic liquid (A.sub.2), and the heat-resistant resin (B) are brought into a solution in which the fine particles of a heat-resistant resin (C) are dispersed. The heat-resistant resin paste may be suitably used for screen process printing to provide integrated circuit devices with insulator layers or surface protecting layers. The heat-resistant resin paste is suitable for forming insulator layers or surface protecting layers in integrated circuit devices by employing screen process printing.

Heat-resistant resin paste and integrated circuit device produced by

1,3-Bis(dicarboxyphenyl)-1,1,3,3-tetraphenyldisiloxane derivatives useful as raw materials of polyimide resins, hardeners for epoxy resins and others and process for producing these derivatives, and polyamic acid and polyamic acid ester, and polyimide resins and processes for producing them from said disiloxane derivatives. The polyimide resins are good in properties such as adhesion to silicon substrates, heat resistance and mechanical properties.

1,3-bis(dicarboxyphenyl)-1,1,3,3-tetraphenyldisiloxane derivative,

A phenolic polymer obtained by reacting a phenolic compound with a bis(hydroxyalkyl)benzene, followed by alkylation of ortho positions or para position with respect to the hydroxyl group of the terminal phenol groups of the produced polymer is suitable for use as a heat resistant antioxidant for thermoplastic resins

A polyimide obtained from a polyamide-acid or polyamide-acid ester prepared by reacting dicyclohexyl-3,4,3', 4'-tetracarboxylic acid or dinanhydride with a diamine is excellent in transparency, heat resistance and mechanical properties, said polyimide being able to be obtained at a lower temperature, and particularly suitable for an orientation film used in a liquid crystal display device.

Dicyclohexyl-3,4,3',4'-tetracarboxylic acid or dianhydride thereof and

Disclosed are a para- or meta-terphenyl-3,4,3',4'-tetracarboxylic acid or a dianhydride and a process for preparing the same. The para- or meta-terphenyl-3,4,3',4'-tetracarboxylic acid or a dianhydride thereof according to the present invention is a novel compound which is useful as a raw material for a polyimide having higher heat resistance and so on.

Para- or meta-terphenyltetracarboxylic acid, dianhydride thereof and

A synthetic resin composition comprising a synthetic resin and a special phenolic polymer is stabilized for a long period of time and excellent in heat resistance and light resistance.

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Hitachi, Japan

Tohru Kikuchi