Tobias Herzig

Tobias Herzig is a notable inventor based in Wuppertal, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on enhancing electronic devices through innovative substrate designs and methods.

Latest Patents

One of Tobias Herzig's latest patents is related to a substrate and method that includes semiconductor material and a conductive via. In this embodiment, the conductive via consists of a via in the substrate, a conductive plug filling a first portion of the via, and a conductive liner layer that lines the side walls of a second portion of the via. This conductive liner layer is electrically coupled to the conductive plug, and both components exhibit different microstructures. Another significant patent involves monitor structures and methods of formation thereof. This method includes forming a first opening and a second opening in a workpiece, where the first opening is deeper than the second. The process further involves forming a fill material within the first opening to create part of a through via and also within the second opening.

Career Highlights

Tobias Herzig is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His work at Infineon has allowed him to push the boundaries of technology and contribute to advancements in electronic devices.

Collaborations

Tobias collaborates with various professionals in his field, including his coworker Albert Birner. Their combined expertise fosters innovation and drives the development of new technologies.

Conclusion

Tobias Herzig's contributions to semiconductor technology through his patents and work at Infineon Technologies AG highlight his role as a key innovator in the industry. His ongoing efforts continue to shape the future of electronic devices.