Sinzing, Germany

Tino Karczewski

USPTO Granted Patents = 2 

Average Co-Inventor Count = 3.7

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2021-2024

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2 patents (USPTO):

Title: The Innovations of Tino Karczewski: A Pioneer in Semiconductor Technology

Introduction

Tino Karczewski, an accomplished inventor based in Sinzing, Germany, has made notable contributions to the field of semiconductor technology. With two patents to his name, he has demonstrated a commitment to advancing the industry through innovative designs and solutions. His work at Infineon Technologies AG showcases his expertise and dedication to pushing the boundaries of modern technology.

Latest Patents

Tino’s latest patents highlight significant advancements in semiconductor packaging.

1. **Lead Adapters for Semiconductor Package**: This patent describes a semiconductor package that features a first semiconductor die encapsulated in an electrically insulating mold compound. It includes a plurality of power leads that facilitate connections with the semiconductor die and a signal lead equipped with a lead adapter retention feature. This design optimizes the interlocked connection between the signal lead and the lead adapter, enhancing signal integrity and reliability.

2. **Semiconductor Package Having Symmetrically Arranged Power Terminals and Method for Producing the Same**: This innovation involves a double-sided coolable semiconductor package that includes an upper electrically conductive element and a lower carrier substrate. The design incorporates multiple electrically conductive layers and spacers, strategically positioning power semiconductor chips to enhance performance and thermal management. The arrangement of power terminals allows for the application of different supply voltages, optimizing the operation of semiconductor devices.

Career Highlights

Tino Karczewski’s career at Infineon Technologies AG has positioned him as a significant figure in semiconductor technology. His innovative approaches and technical acumen have led to the successful development of several high-performance semiconductor packages. His patents not only contribute to the field but also reflect his ability to solve complex engineering challenges.

Collaborations

Throughout his career, Tino has had the opportunity to collaborate with esteemed colleagues such as Juergen Hoegerl and Tao Hong. These partnerships have fostered an environment of creativity and innovation, allowing Tino to leverage a wealth of knowledge and experience, ultimately driving advancements in semiconductor technology.

Conclusion

Tino Karczewski stands as a testament to the impact of inventive minds in the semiconductor sector. His patents demonstrate his ability to innovate and solve problems crucial to the advancement of technology. With ongoing contributions to Infineon Technologies AG and collaboration with knowledgeable peers, Tino’s influence on semiconductor packaging will undoubtedly leave a lasting legacy in the industry.

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