Tinghua Li

Title: Innovations of Tinghua Li in Circuit Board Technology

Introduction

Tinghua Li is a notable inventor based in Zhejiang, China, recognized for his contributions to circuit board technology. With a total of two patents to his name, he has made significant advancements in the field of electronic devices.

Latest Patents

Tinghua Li's latest patents include a molded circuit board and camera module, along with a manufacturing method for these innovations. The molded circuit board features a main body that consists of at least one circuit layer and one substrate layer, which are arranged in a spaced manner. This design is complemented by a molded structure that covers part of the substrate, enhancing the overall functionality. His second patent focuses on a photosensitive assembly that includes a circuit board, a photosensitive chip, and a metal wire. This assembly is designed to improve the structural strength and heat dissipation efficiency of the photosensitive chip, while also minimizing deformation during operation.

Career Highlights

Tinghua Li is currently employed at Ningbo Sunny Opotech Co., Ltd., where he continues to innovate in the field of electronic components. His work has been instrumental in developing technologies that enhance the performance and reliability of electronic devices.

Collaborations

Tinghua has collaborated with notable coworkers, including Zhongyu Luan and Zhen Huang, contributing to a dynamic team focused on advancing circuit board technology.

Conclusion

Tinghua Li's innovative work in circuit board technology and electronic devices showcases his expertise and commitment to improving the industry. His patents reflect a deep understanding of the technical challenges and opportunities within the field.