The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2025
Filed:
Jul. 01, 2020
Ningbo Sunny Opotech Co., Ltd., Zhejiang, CN;
Zhongyu Luan, Zhejiang, CN;
Zhen Huang, Zhejiang, CN;
Bin Lu, Zhejiang, CN;
Li Liu, Zhejiang, CN;
Chengchang Zheng, Zhejiang, CN;
Tinghua Li, Zhejiang, CN;
NINGBO SUNNY OPOTECH CO., LTD., Zhejiang, CN;
Abstract
Disclosed are a molded circuit board and a camera module, and a manufacturing method thereof and an electronic device comprising the same. The molded circuit board includes a circuit board main body and a molded structure. The circuit board main body includes at least one circuit layer and at least one substrate layer, wherein the circuit layer and the substrate layer are stacked in a manner of being spaced apart. The molded structure includes a molded layer, wherein the molded layer is stacked on at least one surface of the circuit board main body to cover at least part of the substrate.