Ting-Yeh Wu

Title: Innovations by Ting-Yeh Wu in Semiconductor Technology

Introduction

Ting-Yeh Wu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on improving semiconductor packaging structures, which are crucial for the efficiency and reliability of electronic devices.

Latest Patents

One of his latest patents is a "Semiconductor packaging structure with back-deposited shielding layer and manufacturing method thereof." This invention provides a batch semiconductor packaging structure that includes a grid with multiple frames glued onto an adhesive substrate. Multiple semiconductor devices align with the corresponding frames and are adhered to the substrate. A metal layer then covers both the semiconductor devices and the grid. The design ensures that the distance between the peripheries of the semiconductor devices and the frames is minimized, which effectively reduces metal scrap during the manufacturing process. This innovation allows for the adhesive substrate to be reusable, thereby decreasing manufacturing costs.

Another significant patent is the "Chip carrier device." This device features a frame, a chip support, and a limiter. The chip support is designed to hold chips securely, with a supporting film that includes through holes for better functionality. The limiter is strategically positioned to enhance the arrangement of chips, ensuring stability and efficiency in the device's operation.

Career Highlights

Ting-Yeh Wu is currently employed at Powertech Technology Inc., a leading company in semiconductor packaging and testing. His work at Powertech has allowed him to push the boundaries of semiconductor technology, contributing to advancements that benefit the electronics industry.

Collaborations

Throughout his career, Ting-Yeh Wu has collaborated with talented individuals such as Shih-Chun Chen and Sheng-Tou Tseng. These collaborations have fostered an environment of innovation and creativity, leading to the development of groundbreaking technologies in semiconductor packaging.

Conclusion

Ting-Yeh Wu's contributions to semiconductor technology through his patents and work at Powertech Technology Inc. highlight his role as a key innovator in the field. His inventions not only improve manufacturing processes but also enhance the performance and reliability of electronic devices.