This inventor holds 2 USPTO granted patents. Top assignee: Winbond Electronics Corporation. Active years: 2022-2024.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2022-2024
Title: Innovations of Ting-Wei Wu
Introduction
Ting-Wei Wu is a notable inventor based in Xiushui, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on improving manufacturing processes and enhancing the performance of semiconductor structures.
Latest Patents
Ting-Wei Wu's latest patents include a double-patterning method to improve sidewall uniformity. This innovative method involves several steps, including the sequential formation of a doped polysilicon layer, a core layer, and an undoped polysilicon layer on a target layer. The undoped polysilicon layer is patterned to create a polysilicon pattern, followed by a first etching process that uses this pattern as a mask to remove part of the core layer, forming a core pattern. A second etching process removes the polysilicon pattern, and an atomic layer deposition (ALD) process is performed to create a spacer material on the core pattern and the doped polysilicon layer. The method concludes with the removal of portions of the core pattern and the underlying doped polysilicon.
Another significant patent by Wu is a method for forming a semiconductor structure. This method includes forming first and second hard mask layers and a target layer on a substrate. The second hard mask layer is patterned to create second wide and narrow masks, followed by the formation of spacers on the sidewalls of these masks. A photoresist layer is then applied to cover the second wide mask and the spacers. The second narrow masks and the photoresist layer are subsequently removed, allowing for the etching of the first hard mask layer with the spacers and the second wide mask as a mask.
Career Highlights
Ting-Wei Wu is currently employed at Winbond Electronics Corporation, where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor manufacturing processes.
Collaborations
He collaborates with esteemed colleagues such as Cheng-Ta Yang and Hsin-Hung Chou, contributing to a dynamic research environment that fosters innovation.
Conclusion
Ting-Wei Wu's contributions to semiconductor technology through his patents and collaborative efforts highlight his role as a significant inventor in the field. His innovative methods are paving the way for advancements in semiconductor manufacturing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
