Ting-Wei Weng

Title: Ting-Wei Weng: Innovator in Semiconductor Technology

Introduction

Ting-Wei Weng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of device pre-cleaning techniques. His innovative approach aims to enhance the efficiency and reliability of semiconductor devices.

Latest Patents

Ting-Wei Weng holds 1 patent for his invention titled "Semiconductor device pre-cleaning." This patent describes a pre-cleaning technique that effectively removes native oxides and other contaminants from semiconductor devices. The method minimizes the risk of chopping, clipping, and sidewall spacer thickness reduction. A protection layer is formed on a capping layer over a gate structure of a transistor, allowing for a pre-cleaning operation that consumes the protection layer instead of the capping layer material. This innovative approach reduces the likelihood of material removal from the capping layer during the pre-cleaning process.

Career Highlights

Ting-Wei Weng is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work focuses on improving semiconductor device fabrication processes, contributing to advancements in technology that impact various electronic applications.

Collaborations

Ting-Wei collaborates with talented individuals in his field, including Yi-Hsiang Chao and Chih-Sheng Chou. Their combined expertise fosters innovation and drives progress in semiconductor technology.

Conclusion

Ting-Wei Weng's contributions to semiconductor technology through his innovative patent demonstrate his commitment to advancing the field. His work not only enhances device performance but also sets a foundation for future developments in semiconductor manufacturing.