This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2022.
Company Filing History:
Years Active: 2022
Title: Ting-Wei Chi: Innovator in Electronic Packaging
Introduction
Ting-Wei Chi is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, showcasing his innovative spirit through his patents. His work focuses on enhancing the durability and functionality of electronic components.
Latest Patents
Ting-Wei Chi holds a patent for an "Electronic package, supporting structure and fabrication method thereof." This invention provides a supporting structure that forms a protective layer on a metal member with multiple conductive posts. The protective layer is designed to be exposed from the end surfaces of the conductive posts, allowing conductors to be formed on these surfaces. This innovation effectively prevents damage to the protective layer, ensuring the longevity and reliability of electronic devices.
Career Highlights
Ting-Wei Chi is currently employed at Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor packaging industry. His role at the company allows him to apply his expertise in electronic packaging and contribute to the development of advanced technologies.
Collaborations
Ting-Wei Chi has collaborated with talented coworkers, including Cho-Hsin Chang and Hao-Ju Fang. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Ting-Wei Chi's contributions to electronic packaging through his patent demonstrate his commitment to innovation in the field. His work not only enhances the performance of electronic devices but also reflects the collaborative spirit of his team at Siliconware Precision Industries Co., Ltd.