This inventor holds 2 USPTO granted patents and 2 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: The Innovations of Ting-Hao Kuo in Integrated Fan-Out Packaging
Introduction: Ting-Hao Kuo is an accomplished inventor based in Hsinchu, Taiwan, recognized for his contributions to the field of integrated fan-out packaging. With a focus on enhancing packaging technology, Kuo has developed innovative methods that are set to improve the efficiency and functionality of electronic components.
Latest Patents: Ting-Hao Kuo holds a notable patent titled "Integrated Fan-Out Packages and Methods of Forming the Same." This invention outlines a comprehensive method that includes forming a composite material layer over a carrier. The innovative process involves several key steps: incorporating particles of a filler material into a base material, creating a set of through vias on the composite layer, and strategically attaching a die while ensuring it is spaced from the vias. The patent further covers the encapsulation of the die and vias using a molding material, forming a redistribution structure, and establishing conductive connectors that facilitate electrical connections.
Career Highlights: Kuo currently works at Taiwan Semiconductor Manufacturing Company Ltd., where he applies his expertise in semiconductor manufacturing and innovative packaging solutions. His significant contributions have not only advanced technology but have also positioned him as a key figure in the industry.
Collaborations: Throughout his career, Ting-Hao Kuo has collaborated with various professionals, including his coworker Kuo-Lung Pan. This synergy in teamwork is crucial in driving the development of pioneering solutions and enhancing product offerings in the semiconductor sector.
Conclusion: Ting-Hao Kuo continues to be a driving force in the field of integrated fan-out packaging. His innovative patent and contributions to Taiwan Semiconductor Manufacturing Company Ltd. exemplify the importance of creativity and research in advancing technology. As he progresses in his career, further innovations are expected to emerge, paving the way for enhanced electronic device capabilities.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile