Ting Chun Wang

Title: Innovations by Ting Chun Wang in Semiconductor Fabrication

Introduction

Ting Chun Wang is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor fabrication, particularly in the area of shallow trench isolation (STI). His innovative approaches have led to advancements that enhance manufacturing processes and product quality.

Latest Patents

Ting Chun Wang holds a patent for the "Planarization of Shallow Trench Isolation (STI)." This patent describes an improved process for fabricating a planarized structure of STI embedded in a silicon substrate. The method involves a two-step chemical-mechanical polishing (CMP) process. The first CMP step utilizes a polishing slurry that is selective to silicon oxide. The duration of the second CMP step is determined by selecting an overpolish thickness based on the percentage of substrate area occupied by the trench. This innovative approach achieves high manufacturing yield and superior planarity for silicon oxide STI.

Career Highlights

Ting Chun Wang is associated with Taiwan Semiconductor Manufacturing Company Ltd., a leading player in the semiconductor industry. His work has been instrumental in developing processes that improve the efficiency and effectiveness of semiconductor manufacturing.

Collaborations

Ting Chun Wang has collaborated with notable colleagues, including Chin Kun Lan and Ying-Lang Wang. These collaborations have fostered an environment of innovation and have contributed to the advancement of semiconductor technologies.

Conclusion

Ting Chun Wang's contributions to the field of semiconductor fabrication, particularly through his patent on shallow trench isolation, highlight his role as an influential inventor. His work continues to impact the industry positively, paving the way for future innovations.