Hsinchu, Taiwan

Ting-Chen Tseng

USPTO Granted Patents = 8 

Average Co-Inventor Count = 4.5

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2022-2025

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8 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Ting-Chen Tseng

Introduction

Ting-Chen Tseng is a notable inventor based in Hsinchu, Taiwan, recognized for his significant contributions to the field of semiconductor packaging. With a total of six patents to his name, he has demonstrated exceptional expertise and creativity in his work, particularly in the area of integrated circuit design.

Latest Patents

One of Ting-Chen Tseng's latest innovations is a patent for a package structure that includes an auxiliary dielectric portion. This innovative package structure consists of a first redistribution layer, which features a semiconductor die and a second redistribution layer. The first layer includes various components such as a first dielectric layer, conductive elements, and an auxiliary dielectric portion, strategically designed to enhance the performance of the semiconductor die.

Another critical patent involves an integrated circuit package and method, detailing a systematic approach to create a multilayered dielectric structure around metallization patterns. This method showcases the intricate process of planarizing dielectric layers and forming successive metallization patterns, resulting in improved electrical connections and device reliability.

Career Highlights

Currently, Ting-Chen Tseng is employed at Taiwan Semiconductor Manufacturing Company, Ltd., one of the leading firms in the semiconductor industry. His role at the company allows him to continue developing innovative solutions that push the boundaries of current technology.

Collaborations

In his professional journey, Ting-Chen has collaborated with talented coworkers, including Sih-Hao Liao and Yu-Hsiang Hu. These collaborations have fostered a creative environment that encourages the exchange of ideas and collective problem-solving, ultimately leading to further advancements in semiconductor technology.

Conclusion

Ting-Chen Tseng's contributions to the semiconductor industry exemplify the impact of innovative thinking and collaboration in technology development. His patents not only represent personal achievements but also have the potential to influence the future of integrated circuit packaging significantly. As advancements in this field continue, inventors like Tseng remain at the forefront of driving technological progress.

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