Timothy Ling

Title: Timothy Ling: Semiconductor Packaging Innovation

Introduction

Timothy Ling is an inventor based in Raleigh, North Carolina, whose patent work addresses the mounting of semiconductor packages. His disclosed approach uses carefully arranged metal pads and selectively placed solder to help position packages during manufacturing. Ling is associated with Creeled, Inc., and has 3 patents.

Latest Patents

One of Ling’s latest listed inventions is “Mounting Arrangements for Semiconductor Packages and Related Methods.” The patent describes mounting arrangements that combine metal pads on substrates with solder placed selectively on portions of those pads. Semiconductor packages are initially positioned over the solder and pad surfaces. As the solder melts and spreads during reflow, it can move the packages along the pads.

The disclosed patterns of pads and solder are designed to control the direction of that movement. This can produce package spacing closer than the placement limits of the equipment used to position the components initially. The supplied patent information lists this title twice with the same description.

Career Highlights

Ling’s patent work focuses on improving precision in semiconductor-package assembly. By using solder reflow to refine component positions, the described method offers a way to achieve tighter spacing than initial pick-and-place positioning alone may allow. His work is associated with Creeled, Inc.

Collaborations

The supplied information identifies Ryan Mohn and David N. Randolph as Ling’s coworkers. It does not specify their roles in the patent or describe particular collaborations.

Conclusion

Timothy Ling’s disclosed invention applies controlled solder movement to improve semiconductor-package placement and spacing, reflecting a practical contribution to manufacturing innovation.