Timothy L Brown

Title: Biography of Inventor Timothy L Brown

Introduction

Timothy L Brown is an accomplished inventor based in Vancouver, WA (US). He has made significant contributions to the field of semiconductor technology, holding a total of three patents. His innovative work focuses on methods and apparatuses that enhance the manufacturing processes of semiconductor wafers.

Latest Patents

One of his latest patents is titled "Methods and apparatus for predicting oxygen-induced stacking fault density in wafers." This invention presents a method for predicting the density of oxygen-induced stacking faults (OSF) on the surface of a wafer by measuring surface roughness before and after a damaging process. The process can involve various techniques such as wet sand blasting, dry sand blasting, lapping, surface grinding, and laser irradiation. The invention includes an automated computer-assisted apparatus that evaluates OSF density by correlating surface roughness data.

Another notable patent is "Double side polished wafers having external gettering sites, and method of producing same." This patent describes a semiconductor wafer manufacturing process that results in a double side polished wafer with oxygen-induced stacking faults, which provide extrinsic gettering on the back surface. The process involves polishing the back surface, depositing a thin polysilicon film, and subjecting the wafer to thermal oxidation, ultimately leading to the creation of extrinsic gettering sites.

Career Highlights

Timothy L Brown is currently employed at SEH America, Inc., where