Timothy E Dearden

Title: Innovations of Timothy E Dearden

Introduction

Timothy E Dearden is a notable inventor based in Torrance, CA (US). He has made significant contributions to the field of integrated circuit technology, holding a total of 3 patents. His work has been instrumental in advancing the efficiency and functionality of electronic devices.

Latest Patents

One of Timothy's latest patents is for a stacked integrated circuit assembly. This invention outlines a method of producing a stacked integrated circuit assembly that includes providing a substrate with a top surface featuring at least one substrate connection pad. A first flip chip integrated circuit (FFIC) is positioned above the substrate, while a second flip chip integrated circuit (SFIC) is placed above the FFIC. The FFIC is situated between the substrate and the SFIC, with solder connections established between the substrate connection pad and the FFIC, as well as between the FFIC and the SFIC. This innovative design enhances the performance and compactness of integrated circuits.

Career Highlights

Timothy E Dearden is currently employed at Raytheon Company, where he continues to develop cutting-edge technologies. His expertise in integrated circuits has made him a valuable asset to the company, contributing to various projects that push the boundaries of electronic engineering.

Collaborations

Throughout his career, Timothy has collaborated with talented individuals such as Clifton Quan and Tse E Wong. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Timothy E Dearden's contributions to the field of integrated circuits exemplify the spirit of innovation. His patents and work at Raytheon Company highlight his commitment to advancing technology and improving electronic devices.