Vantaa, Finland

Timo T Varpula

This inventor holds 1 USPTO granted patent. Top assignee: Valmet-Tampella Oy. Active years: 1996.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Timo T Varpula. Retrieved from https://idiyas.com/inventor/timo-t-varpula

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 1996

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1 patent (USPTO):Explore Patents

Title: Timo T Varpula: Innovator in Slot Measurement Technology

Introduction

Timo T Varpula is a notable inventor based in Vantaa, Finland. He has made significant contributions to the field of measurement technology, particularly in determining the size and shape of slots. His innovative approach has led to the development of a patented method that enhances accuracy in this area.

Latest Patents

Timo holds a patent for a "Method and apparatus for determining the size and shape of a slot." This invention showcases his expertise and commitment to advancing measurement techniques. He has 1 patent to his name, reflecting his innovative contributions to the industry.

Career Highlights

Timo is currently employed at Valmet-Tampella Oy, a company known for its engineering solutions. His role at the company allows him to apply his inventive skills in practical applications, contributing to the company's success and innovation.

Collaborations

Throughout his career, Timo has collaborated with talented individuals such as Heikki J Seppa and Mayri O Sundstrom. These partnerships have fostered a creative environment that encourages the exchange of ideas and advancements in technology.

Conclusion

Timo T Varpula is a distinguished inventor whose work in slot measurement technology has made a lasting impact. His patent and collaborations highlight his dedication to innovation and excellence in engineering.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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