Hong Kong, China

Tim Wai Mak

This inventor holds 1 USPTO granted patent. Top assignee: Asm Technology Singapore Pte Ltd. Active years: 2014.


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2014

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Tim Wai Mak: Innovator in Bonding Tool Technology

Introduction

Tim Wai Mak is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of bonding tool technology. His innovative approach has led to the development of a unique patent that enhances the efficiency of bonding processes.

Latest Patents

Tim Wai Mak holds a patent for an "Image-assisted system for adjusting a bonding tool." This invention allows for the adjustment of a bonding tool to a desired operational position by utilizing an image-capturing device. The system displays an image of the bonding tool on a screen, superimposing a reference image of a bonding tool that shows the desired position. This innovative method ensures precise alignment and adjustment of the bonding tool.

Career Highlights

Tim is currently employed at Asm Technology Singapore Pte Ltd, where he continues to work on advancements in bonding technology. His expertise and innovative mindset have made him a valuable asset to his company.

Collaborations

Some of Tim's coworkers include Jiang Wen Deng and Hei Lam Chang. Their collaborative efforts contribute to the ongoing development of cutting-edge technologies in their field.

Conclusion

Tim Wai Mak's contributions to bonding tool technology exemplify the spirit of innovation. His patent reflects a commitment to improving operational efficiency in bonding processes. His work continues to inspire advancements in the industry.

Profile summary based on public USPTO records.
Please report any incorrect information to [email protected]
Loading…