Company Filing History:
Years Active: 2003-2008
Title: Tim A Renfro: Innovator in Thermal Management Technologies
Introduction
Tim A Renfro is a prominent inventor based in Mesa, AZ, known for his contributions to thermal management technologies. With a total of 9 patents to his name, Renfro has made significant advancements in the field, particularly in the design and functionality of heat sinks and socket structures.
Latest Patents
Among his latest patents is a method for thermally coupling an integrated heat spreader to a heat sink base. This innovative design allows for selective plating of the heat sink base with a solder wetting material, enabling it to be soldered to an integral heat spreader that is also selectively plated with gold. Another notable patent focuses on a method for reducing socket warpage. This method involves forming grooves in a socket housing contiguous to a surface mount region for an electrical device and securing a rigid bar in the groove to enhance structural integrity.
Career Highlights
Tim A Renfro is currently employed at Intel Corporation, where he continues to develop cutting-edge technologies that improve thermal management in electronic devices. His work has been instrumental in enhancing the performance and reliability of various electronic components.
Collaborations
Renfro has collaborated with notable colleagues, including Jiteender P Manik and Brian C Kluge, contributing to a dynamic team focused on innovation and excellence in technology.
Conclusion
Tim A Renfro's contributions to thermal management technologies have established him as a key figure in the field. His innovative patents and ongoing work at Intel Corporation continue to influence the future of electronic design and functionality.