The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2006
Filed:
May. 13, 2004
Tim A. Renfro, Mesa, AZ (US);
Tim A. Renfro, Mesa, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A land grid array socket may receive an integrated circuit package for electrical connection thereto through lands on the integrated circuit package and spring contacts which extend upwardly to engage those lands from the socket. A protector plate may be situated over the spring contacts prior to the time at which the integrated circuit package is assembled onto the socket. As a result, the spring contacts on the socket may be prevented from damage prior to the time that they are engaged by the integrated circuit package.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile