Company Filing History:
4 out of 448 
4 out of 254 
2 out of 211 
Years Active: 2014-2018
Title: Tien-I Kao: Innovator in 3D Printing Technology
Introduction
Tien-I Kao is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of 3D printing technology, holding a total of 4 patents. His innovative work focuses on enhancing the efficiency and functionality of 3D printing devices and methods.
Latest Patents
One of his latest patents is titled "Three-dimensional printing device and method for storing printing data thereof." This invention includes a processing unit and a mixing unit that formats a sliced file into a printing head signal file. The processing unit ensures that the sliced file and the printing head signal file correspond to a three-dimensional structure. The mixing unit combines parts of the layer data and layer printing data to create a hybrid file, which is then stored in an electronic device.
Another notable patent is the "Method for arranging joints to 3D model, arranging apparatus for the method, and application program for using the same." This method involves obtaining a 3D file and executing a slicing process to create multiple cross sections. It determines if the differences between cross-section areas exceed a threshold and arranges joint data accordingly, ultimately outputting the arranged 3D model for printing.
Career Highlights
Throughout his career, Tien-I Kao has worked with several notable companies, including Kinpo Electronics, Inc. and Cal-Comp Electronics & Communications Company Limited. His experience in these organizations has contributed to his expertise in 3D printing technologies and innovations.
Collaborations
He has collaborated with talented individuals such as Ting-Yu Lu and Hsien-Chung Chen, further enhancing his work in the field of 3D printing.
Conclusion
Tien-I Kao's contributions to 3D printing technology through his patents and collaborations highlight his role as an influential inventor in this rapidly evolving field. His innovative methods and devices continue to shape the future of 3D printing.