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New Taipei, Taiwan

Cal-Comp Electronics & Communications Company Limited

USPTO Granted Patents = 254

% Expired Patents = 69.7

EPO Patents = 16

Trademarks = 1

Forward Citations = 1,978

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200 inventors (with patents filed for the assignee):

Yang-Teh Lee (16 out of 35 patents)

Jiann-Hung Lee (16 out of 16 patents)

Kwan Ho (15 out of 23 patents)

4. Peng-Yang Chen (14 out of 23 patents)

5. Shih-Jer Din (13 out of 14 patents)

6. Jia-Yi Juang (11 out of 20 patents)

7. Che-Hsin Liao (11 out of 11 patents)

8. Chun-An Hsu (10 out of 12 patents)

9. Wen-Ten Lin (10 out of 11 patents)

10. Jui-Feng Chang (10 out of 10 patents)

11. Hsien-Chang Wu (10 out of 10 patents)

12. Ching-Yu Su (10 out of 10 patents)

13. Chieh Kao (9 out of 9 patents)

14. Wen-Chun Chung (9 out of 10 patents)

15. Ming-Hsiung Ding (8 out of 15 patents)

Core Competencies:

Three-Dimensional Printing

3D Printing Apparatus

Calibration Methods

Data Generation

Printing Temperature Control

Sensing Device

Printing Head Module

Material Filling

Coordinate Offset Compensation

Dynamic Entrance Control

Post Cure Box

Filament Fusing

254 patents: Sort by Forward Citations

1. 11762318 - Automatic detection method for paper size (2023-09-19),

2. 10821719 - Three-dimensional printing apparatus and method for three-dimensional printing (2020-11-03),

3. 10678215 - Three dimensional printing method and three dimensional printing apparatus (2020-06-09),

4. 10591896 - 3D printing data generating method and electronic device using the same (2020-03-17),

5. 10589442 - Processing method for printing information of powder-bed type 3D printing (2020-03-17),

6. 10539949 - Three-dimensional printing appratus and method for calibrating printing inaccuracy thereof (2020-01-21),

7. 10361004 - Method for obtaining skin care information, method for sharing skin care information, and electronic apparatus therefor (2019-07-23),

8. 10286645 - Three-dimensional printing apparatus and method for compensating coordinate offset between nozzles thereof (2019-05-14),

9. 10274934 - Data generating method for 3D printing, method for printing a 3D object, and system for processing 3D printing data (2019-04-30),

10. 10252467 - Control method of printing temperature and device thereof (2019-04-09),

11. 10225685 - Method for assisting positioning and movable electronic device thereof (2019-03-05),

12. 10173411 - Three-dimensional printing apparatus (2019-01-08),

13. 10159386 - Face cleaning apparatus (2018-12-25),

14. 10144208 - Method for detecting characteristic of forming material and three-dimensional printing apparatus (2018-12-04),

15. 10144193 - Textile structure (2018-12-04),

Company Overview

Cal-Comp Electronics & Communications Company Limited, based in New Taipei, Taiwan, specializes in the development and manufacturing of advanced three-dimensional printing technologies. The company focuses on various aspects of 3D printing, including apparatus design, calibration methods, and temperature control systems, ensuring precision and quality in the printing process. With expertise in data generation and sensing devices, Cal-Comp is positioned at the forefront of innovation in the 3D printing sector, catering to diverse industrial applications.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

254 Patents

#20 in New Taipei

#114 in Taiwan

#3,443 in the World

New Taipei, Taiwan

Cal-Comp Electronics & Communications Company Limited

Forward Citations = 1,978

200 inventors:

Yang-Teh Lee (16 out of 35 patents)

Jiann-Hung Lee (16 out of 16 patents)

Kwan Ho (15 out of 23 patents)

4. Peng-Yang Chen (14 out of 23 patents)

5. Shih-Jer Din (13 out of 14 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Cal-Comp Electronics & Communications Company Limited. Retrieved from https://idiyas.com/company/cal-comp-electronics-and-communications-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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