The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 04, 2018

Filed:

Jan. 16, 2015
Applicants:

Kinpo Electronics, Inc., New Taipei, TW;

Cal-comp Electronics & Communications Company Limited, New Taipei, TW;

Inventors:

Koichi Haraikawa, New Taipei, TW;

Jen-Chien Chien, New Taipei, TW;

Tsai-Chieh Hsu, New Taipei, TW;

Chih-Wei Liu, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/26 (2006.01); B32B 3/26 (2006.01); A61B 5/00 (2006.01); B32B 5/06 (2006.01); B32B 5/22 (2006.01); B32B 7/12 (2006.01); B32B 25/08 (2006.01); B32B 25/10 (2006.01); B32B 25/14 (2006.01); B32B 27/12 (2006.01); A41D 1/00 (2018.01);
U.S. Cl.
CPC ...
B32B 5/26 (2013.01); A61B 5/6804 (2013.01); B32B 3/266 (2013.01); B32B 5/06 (2013.01); B32B 5/22 (2013.01); B32B 7/12 (2013.01); B32B 25/08 (2013.01); B32B 25/10 (2013.01); B32B 25/14 (2013.01); B32B 27/12 (2013.01); A41D 1/002 (2013.01); B32B 2262/103 (2013.01); B32B 2262/106 (2013.01); B32B 2307/202 (2013.01); B32B 2307/51 (2013.01); B32B 2307/724 (2013.01); B32B 2307/726 (2013.01); B32B 2307/73 (2013.01); B32B 2457/00 (2013.01);
Abstract

A textile structure adapted to be electrically connected to an electronic device is provided. The textile structure includes a first fabric layer, a second fabric layer, and a third fabric layer. The second fabric layer is electrically conductive. The first, the second, and the third fabric layers are combined with each other, and the second fabric layer is located between the first and the third fabric layers. The third fabric layer has an opening covered by the second fabric layer, and a portion of the second fabric layer is exposed from the third fabric layer through the opening. The electronic device is electrically connected to the second fabric layer, and a junction between the electronic device and the second fabric layer is far away from the opening.


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