Taichung, Taiwan

Tien-Der Chiang

This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tien-Der Chiang. Retrieved from https://idiyas.com/inventor/tien-der-chiang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: Tien-Der Chiang: Innovator in Semiconductor Problem Case Packaging

Introduction

Tien-Der Chiang is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor manufacturing through his innovative patent. His work focuses on improving the efficiency of problem case packaging, which is crucial in the semiconductor industry.

Latest Patents

Tien-Der Chiang holds a patent titled "Method and system for problem case packaging." This patent describes a method for handling manufacturing problem information related to semiconductor products. The process involves collecting problem information from various entities involved in fabrication and organizing this information into problem cases stored in a database. Each case represents a specific manufacturing issue and is linked to relevant problem information.

Career Highlights

Tien-Der Chiang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His role involves leveraging his expertise to enhance manufacturing processes and address challenges faced in semiconductor production.

Collaborations

Throughout his career, Tien-Der Chiang has collaborated with esteemed colleagues, including Wen-Chang Kuo and Chien-Chung Huang. These collaborations have contributed to the advancement of semiconductor technologies and problem-solving methodologies.

Conclusion

Tien-Der Chiang's innovative approach to problem case packaging has made a significant impact on the semiconductor manufacturing sector. His contributions continue to influence the efficiency and effectiveness of production processes in this critical industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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