Tien-Chun Wang

Title: Tien-Chun Wang: Innovator in Semiconductor Technology

Introduction

Tien-Chun Wang is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on innovative methods for forming metal gate structures in semiconductor devices.

Latest Patents

Wang's latest patents include a method for forming a semiconductor device that involves providing a semiconductor substrate, a metal gate stack, and an insulating layer. This method outlines the formation of source and drain regions in the substrate, with the metal gate stack positioned between them. The process includes creating contact openings through the insulating layer to expose these regions, followed by a pre-amorphized implantation process to form amorphous regions. Additionally, he has developed mechanisms for forming a semiconductor device that incorporates metal silicide regions in the source and drain regions, along with a dielectric spacer liner layer.

Career Highlights

Tien-Chun Wang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise and innovative approaches have positioned him as a key player in advancing semiconductor technology.

Collaborations

Wang has collaborated with notable colleagues, including Yi-Chun Lo and Chia-Der Chang, contributing to various projects that enhance semiconductor device performance.

Conclusion

Tien-Chun Wang's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His innovative methods continue to shape the future of semiconductor devices.