Tien-chih Cheng

Title: Tien-chih Cheng and Advances in Ceramic Materials

Introduction

Tien-chih Cheng is an inventor based in Hsinchu, Taiwan, and is associated with Taiwan Semiconductor Manufacturing Company, Ltd. His work includes a patented ceramic material and manufacturing approach relevant to semiconductor equipment. The available information lists 1 patent for Cheng.

Latest Patents

Cheng’s patent, “Ceramic Article, Semiconductor Apparatus for Manufacturing a Semiconductor Structure and Method of Manufacturing a Ceramic Article,” describes a ceramic body containing a spinel (MgAlO) structure. The patent specifies that the spinel’s density must exceed 99.5% of the theoretical density of spinel.

The invention also describes semiconductor manufacturing apparatus that incorporates this ceramic article. Its manufacturing method involves providing a green body, heating it to a sintering temperature, compressing it, and applying an electrical pulse. These steps produce a ceramic body containing the specified spinel structure.

Career Highlights

Cheng’s listed patent connects advanced ceramic processing with semiconductor manufacturing equipment. The invention’s focus on high-density spinel and a process combining heat, compression, and electrical pulses reflects an effort to produce ceramic components with tightly controlled material properties.

Collaborations

The listed coworkers associated with Cheng are Ren-guan Duan and Li-chun Wang. The available information does not specify their individual contributions to the patent.

Conclusion

Tien-chih Cheng’s patent documents a ceramic material and manufacturing method designed for semiconductor applications, highlighting his contribution to materials innovation in the field.